MX can be flexibly embedded in various positions on the car, including behind the windshield, on the roof, within the headlights, and in the intake grille, perfectly complementing the vehicle's design while facilitating easier deployment.

As the most integrated SoC in the industry, M-Core breaks through by integrating the entire backend circuit into a single chip, reducing the size of main board by 50%, reducing power consumption by 40% and significantly reducing costs.

MX inherits the mature and compact transceiver module of the M platform and the internal transceiver chip has been upgraded and iterated. Compared to M1 Plus, MX has 40% reduction in volume, 44% reduction in thickness, a power consumption less than 10W, a significant reduction in cost and a significant improvement in manufacturability.

Inheriting a modular and platform-based design, subsequent iterations of MX products feature pin-to-pin upgrades to core components. With the premise of maintaining the same specifications such as point cloud scanning form and data interface, it can continuously evolve and achieve performance upgrades generation by generation, helping customers to continuously optimize the intelligent driving performance and cost of new vehicle models with minimal secondary development costs, enabling a higher level of intelligent driving experience continuously.